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Miller Design and Equipment - New and Used Refurbished Equipment for the Semi-conductor Industry


 

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Basic Operation of FPP 5000

The VEECO FPP-5000 4-point probe simplifies the measurement of resistive properties of semiconductor wafers and resistive films. The microprocessor based electronics permits direct computation of V/I, sheet or slice resistivity, and metallization thickness and P-N type testing. Unlike most four point probes and probing stations, which move the probe head into the wafer, the FPP-5000 is designed so that the wafer is moved into the probe head. This insures constant probe force independent of operator force and wafer thickness.

Keyboard Description

  • V/I - Displays measured V/I multiplied by programmed GEOM Constant.
  • SHEET - Displays sheet resistance based on measured V/I.
  • SLICE - Calculates the bulk resistivity of a slice of layer whose thickness is entered in the PRGM mode.
  • THICK - Calculates the thickness of a layer of slices whose bulk resistivity is entered in the PRGM mode.
  • TYPE - When selected, a type test is performed.
  • PEN - When selected, a penetrate voltage is applied to the sample.
  • PRGM - Put the keyboard into the PRGM mode for entering bulk resistivity or film thickness. Press STORE afterwards to store the input into system memory.
  • SELF-TEST - Performs a system self test.
  • RETEST - Performs a retest when the previous test failed.
  • CONST - Displays the selected input stored in the memory.
  • Numerical Keys - To enter the input required for calculation.
  1. Wafer Measurements in General

1. Determine thickness of wafer with micrometer (remember the thickness).

    1. Adjust the rear stop by loosening the thumb screw and moving the position of the stop to the appropriate wafer size position. (100mm, 125mm, 150mm, 2 inch, and 3 inch positions are in accordance with SEMI STD MI. 1.)
    2. Place the wafer you wish to probe in the appropriately sized wafer holder.
    3. Place the appropriate size backing plate with the spiral side facing the wafer.
    4. Slide the wafer holder forward so that it is "banking" on the front stop. The wafer is now positioned to be probed in the center.
    5. Ensure the power to the FPP 5000 is on. The power switch is located on the left rear of the FPP 5000.
    6. Select the SLICE mode and ensure the indicator light illuminates.
    7. Depress the PRGM mode and ensure the indicator light illuminates.
    8. Enter the wafer thickness in microns and depress the STORE key. The display should wink.
    9. Depress the PRGM mode and ensure the indicator light goes out.
    10. Select the proper display mode. Each switch illuminates when you depress the switch for the mode that you want. Depressing the switch a second time causes the mode to be deselected. The modes are

V/I switch - Displays measured V/I multiplied by programmed GEOM constant.

SHEET resistance switch - Displays the resistivity based on the measured V/I.

SLICE resistivity displays switch - Calculates the bulk resistivity of a slice or a layer whose thickness is entered by means of the PRGM mode keyboard switches.

THICK switch - Calculates the thickness of a layer or slices whose slice resistivity is entered on the PRGM mode keyboard switches.

    1. Close the cover and hold it down to initiate a test. The display will go blank and the TEST indicator adjacent to the display will illuminate for not more than 2 seconds at which time the display will reappear. E 02 will appear on the display if the cover is released before a measurement is completed.

By depressing the RETEST button, with the cover down, you can reinitiate the test. The display will indicate E 01 if the cover is not held down while pressing the retest button.

It is recommended that all measurements be performed with the cover closed to eliminate effects due to light and RFI

    1. Open the cover.
    2. Slide the wafer holder so that it "banks" against the rear stop and rotate it so that the location marked "2" is facing you (90o).
    3. Probe this location as was done in step 5.
    4. Repeat steps 6 through 8 for locations marked 3, 4, and 5.
    5. Remove the wafer backing plate and remove the wafer.
  1. Determining a Layer Thickness
    1. Press the THICK switch and observe that the THICK indicator illuminates.
    2. Press the PRGM switch to put the instrument in the program mode. Observe that the PRGM indicator and units indicator W - cm are illuminated.
    3. Enter the slice resistance of the aluminum layer.
    4. Press STORE and observe that the display winks.
    5. Press the PRGM switch to exit from the program mode. Observe that the PRGM indicator extinguishes.
    6. Follow procedure A using the THICK mode.
  2. Determine Layer Resistivity
    1. Press the SLICE switch and observe that the SLICE indicator illuminates.
    2. Press the PRGM switch to put the instrument in the program mode. Observe that the PRGM indicator and the units indicator MIL are illuminated.
    3. Enter the layer thickness in microns using the unit selection and data entry switches.
    4. Press the m key to change units from MILS to microns. Observe that the m indicator illuminates.
    5. Press STORE and observe that the display winks.
    6. Press the PRGM switch to exit from the program mode. Observe that the PRGM mode indicator extinguishes.
    7. Follow procedure A ensuring that you use the SLICE mode.
  3. Determining Layer Conductivity Type
    1. Adjust the rear stop by loosening the thumb screw and moving the position of the stop to the appropriate wafer size position. (100mm, 125mm, 150mm, 2 inch, and 3 inch positions are in accordance with SEMI STD MI. 1.)
    2. Place the wafer you wish to probe in the appropriately sized wafer holder.
    3. Place the appropriate size backing plate with the spiral side facing the wafer.
    4. Slide the wafer holder forward so that it is "banking" on the front stop. The wafer is now positioned to be probed in the center.
    5. Ensure the power to the FPP 5000 is on. The power switch is located on the left rear of the FPP 5000.
    6. Select the V/I switch and ensure the V/I indicator illuminates.
    7. Close the cover and hold it down to initiate a test. The display will go blank and the TEST indicator adjacent to the display will illuminate for not more than 2 seconds at which time the display will reappear. E 02 will appear on the display if the cover is released before a measurement is completed.

By depressing the RETEST button, with the cover down, you can reinitiate the test. The display will indicate E 01 if the cover is not held down while pressing the retest button.

It is recommended that all measurements be performed with the cover closed to eliminate effects due to light and RFI

    1. Press the TYPE switch and notice that the TYPE indicator illuminates. The type of the wafer will be indicated on the display.
    2. Open the cover.
    3. Remove the wafer backing plate and remove the wafer.
  1. Using the Pen Feature
    1. The PEN function applies a High Voltage low energy pulse to the probe tips in order to break down any thin oxide that has grown on the sample.
    2. To enable the PEN function depress the PEN switch before step 7 in part A. Ensure that the PEN indicator illuminates.
    3. To disable the Pen function depress the PEN switch and ensure the PEN indicator goes out.

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Last modified: 05/06/09